Pyrolytic Boron Nitride (PBN) Sheet, Plate & Substrate

Advanced Thermal Insulation for Semiconductor Growth

In high-temperature environments (up to 2000°C) and Ultra-High Vacuum (UHV) systems, standard sintered ceramic components often fail due to outgassing or thermal stress. For semiconductor growth applications like GaAs or InP MBE, a reliable Pyrolytic Boron Nitride sheet is the industry standard for thermal shielding and electrical insulation.

1. Zero Outgassing in UHV Environments

A common failure point in vacuum chambers is outgassing from ceramics containing binders. Our components are manufactured using a specialized Chemical Vapor Deposition (CVD) process. This CVD boron nitride material is 100% binder-free, achieving a purity of ≥99.99%. It guarantees zero contamination, maintaining the integrity of your epitaxial growth.

2. Thermal Anisotropy: Directional Heat Management

The unique crystallographic structure of a PBN plate provides distinct thermal properties depending on the direction. In the in-plane direction, it exhibits high thermal conductivity to rapidly spread heat and ensure uniformity. Conversely, in the out-of-plane direction, it acts as an exceptional thermal insulator. This makes it highly effective as a directional heat shield or element support.

3. Precision CNC Customization for Complex Designs

From ultra-thin OLED shadow masks to a specialized custom PBN washer for heating assemblies, our advanced CNC machining capabilities handle the most intricate designs. Whether you require stepped surfaces, counterbores, or a highly polished PBN ceramic substrate, our components are machined with clean, non-shedding edges, arriving ready for cleanroom deployment.