Boron Nitride Plate, hBN Sheet, BN Ceramic Baffle, Hexagonal Boron Nitride Plate, and 2100C vacuum ceramic plate are mainly used in vacuum systems, semiconductor equipment, high-temperature thermal process assemblies, and related ceramic insulation structures. These components are designed for applications that require thermal stability, electrical insulation, dimensional consistency, and suitable chemical compatibility in vacuum or elevated-temperature environments.
According to different equipment structures and service conditions, these products can be machined into flat plates, baffles, sheet parts, slotted panels, hole-pattern ceramic plates, and custom insulating structures. They are commonly used for thermal shielding, structural spacing, electrical isolation, non-wetting contact surfaces, and matching installation positions in semiconductor, crystal growth, and vacuum process equipment.
1. Typical Product Forms
- Boron Nitride Plate for thermal shielding, support, and insulation applications
- hBN Sheet for flat ceramic structures and custom high-temperature assemblies
- BN Ceramic Baffle for flow separation, shielding, and furnace-related structures
- Hexagonal Boron Nitride Plate for vacuum and process equipment insulation positions
- 2100C vacuum ceramic plate for high-temperature vacuum-related ceramic applications
2. Material Features of High Purity BN
High purity boron nitride is commonly used in vacuum and high-temperature environments because of its good electrical insulation, thermal stability, low wetting behavior, and machining adaptability. These characteristics make it suitable for plate, sheet, baffle, and custom ceramic structures used in semiconductor equipment, crystal growth systems, molten material handling, and related thermal process applications.
| Feature | Typical Benefit |
|---|---|
| Electrical Insulation | Suitable for dielectric separation in equipment assemblies |
| Thermal Stability | Suitable for elevated-temperature vacuum applications |
| Low Wetting Behavior | Helps reduce adhesion of some molten materials |
| Machinability | Supports holes, slots, steps, grooves, and custom plate geometries |
| Chemical Compatibility | Applicable to many vacuum and process system conditions |
3. Machining Features of hBN Sheet and BN Ceramic Baffle
The hBN Sheet and BN Ceramic Baffle often require controlled length, width, thickness, flatness, hole position accuracy, slot dimensions, and fitting surface details. For thin plates, large-size panels, slotted structures, stepped features, or parts with multiple drilled holes, machining feasibility should be reviewed according to drawings, tolerance requirements, and actual assembly conditions. Proper machining control helps improve fitting consistency and service stability.
4. Applications of Hexagonal Boron Nitride Plate and 2100C Vacuum Ceramic Plate
Hexagonal Boron Nitride Plate and 2100C vacuum ceramic plate products are commonly used in vacuum furnaces, semiconductor process equipment, crystal growth systems, thermal shielding assemblies, molten material contact structures, and laboratory high-temperature research hardware. Depending on the design, these parts may involve flat insulation surfaces, baffle geometries, mounting holes, slots, or other non-standard ceramic plate structures.
5. Custom Machining Capability
- Custom sizes, thicknesses, and plate geometries are available
- Support for flat plates, slotted sheets, drilled panels, and custom baffle structures
- Support for holes, steps, grooves, fitting surfaces, and custom matching features
- Suitable for Boron Nitride Plate and BN Ceramic Baffle applications
- Machining can be evaluated according to drawings and actual service conditions
6. Key Parameters to Confirm
- Length, width, thickness, and local wall section dimensions
- Hole size, slot dimensions, spacing, and positional tolerances
- Flatness, surface condition, and fitting surface details
- Working temperature, vacuum level, and process atmosphere
- Contact material, thermal cycling conditions, and load requirements
- Cleanliness requirements and packaging expectations
7. Common Application Scenarios
- Vacuum furnace insulation and shielding structures
- Semiconductor thermal process equipment
- Crystal growth and hot-zone related assemblies
- Molten material handling and non-wetting contact surfaces
- Custom ceramic plate parts for laboratory and industrial systems
8. Common Product Names
Depending on the process, drawing habits, and equipment structure, these products may be referred to as Boron Nitride Plate, hBN Sheet, BN Ceramic Baffle, Hexagonal Boron Nitride Plate, or 2100C vacuum ceramic plate. Different names may correspond to different plate structures, baffle layouts, and actual service conditions.
9. Drawing Review Suggestion
For Boron Nitride Plate and related sheet or baffle components, it is recommended to provide complete drawings, key dimensions, tolerance requirements, working temperature, vacuum level, contact material, and assembly conditions. For Hexagonal Boron Nitride Plate and 2100C vacuum ceramic plate applications, confirming the material grade, structural details, and matching hardware in advance can help improve compatibility and service stability.
Related Products
Material Reference
Boron Nitride Material Overview
Technical Support: Mr. Zhang | Direct / WeChat: +86-18602175437 | Email: telice@teliceramic.com
Key components: Boron Nitride Plate, hBN Sheet, BN Ceramic Baffle, Hexagonal Boron Nitride Plate, and 2100C vacuum ceramic plate.
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