PBN VGF Crucible for GaAs & InP Crystal Growth

¥1,999.00

Ultra-High Purity Pyrolytic Boron Nitride (PBN) VGF Crucibles Engineered specifically for the Vertical Gradient Freeze (VGF) process, our CVD-grown PBN crucibles provide the highly stable thermal and chemical environment required for synthesizing III-V compound semiconductors like GaAs and InP.

  • Zero Wetting: Non-wetting surface prevents melt adhesion, eliminating crystal stress, dislocations, and cracking during the cooling phase.

  • Ultra-High Purity (≥99.99%): 100% binder-free structure prevents outgassing and impurity-induced polycrystalline nucleation.

  • Precision Seed Well: High-precision CNC machining ensures accurate seed well dimensions for perfect thermal gradient matching.

  • Note: The price listed above is for reference only. Final pricing is subject to your actual dimensions and technical drawings.

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Solving Dislocation and Stress in Single Crystal Growth

In the manufacturing of III-V compound semiconductors (such as GaAs and InP), minimizing the Etch Pit Density (EPD) is a constant challenge for researchers. When utilizing the Vertical Gradient Freeze process, the interaction between the melt and the container wall is critical. Selecting a reliable VGF crucible is the first step to ensuring high-yield, low-stress crystal synthesis.

1. Zero Wetting for Stress-Free Demolding

During the VGF process, crystals grow upward from the bottom seed. If the melt adheres to the crucible wall, the differing coefficients of thermal expansion will cause severe internal stress or even crack the crystal during the cooling phase. Upgrading to a Vertical Gradient Freeze crucible made of Pyrolytic Boron Nitride solves this issue. The exceptional non-wetting properties of PBN ensure that the grown crystal simply glides out, completely preventing adhesion-induced dislocations.

2. High Purity to Prevent Polycrystalline Nucleation

Growing single crystals requires maintaining a stable environment at around 1200°C for extended periods. Any impurities released from the container can act as nucleation sites, causing unwanted polycrystalline growth. Telite Ceramics utilizes a Chemical Vapor Deposition (CVD) process to manufacture each pyrolytic boron nitride crucible. With a guaranteed purity of ≥99.99% and zero binders, it provides a perfectly clean environment, making it a highly dependable GaAs crystal growth crucible.

3. Precision Seed Well Machining

The success of the VGF method heavily depends on the precision of the seed well at the bottom of the container. If the well’s inner diameter is too large, the seed crystal will melt; if it is poorly machined, proper thermal contact is lost. Telite Ceramics employs advanced CNC machining to deliver a PBN crystal growth crucible with micrometer-level precision in the seed well area, ensuring perfect compatibility with your specific thermal field.

Customization & RFQ Guide

We provide extensive customization for R&D laboratories and semiconductor production lines. Please Contact Telite Ceramics and provide the following for an accurate quote:

  • Crucible dimensions, specifically Seed Well (ID/OD) and taper angles (CAD drawings preferred)
  • Operating temperature profile and target material (e.g., GaAs, InP)
  • Specific crystal growth furnace compatibility

Technical Director: Engineer Zhang (张工)
Tel / WhatsApp / WeChat: +86-18602175437
Email: telice@teliceramic.com
Xiamen Telite New Material Technology Co., Ltd.

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